New PDF release: Contamination of Electronic Assemblies

By Elissa M. Bumiller, David A. Douthit, Joan Pecht

ISBN-10: 0849314836

ISBN-13: 9780849314834

Michael Pecht, Elissa M. Bumiller, and Joan Pecht (all: U. of Maryland-College Park) and David A. Douthit (with a personal corporation) supply details for deciding upon, mitigating, and dealing with infection in digital units at phases starting from the manufacture of the glass fibers utilized in the laminates to the total meeting of the completed product. Their step by step process publications readers to the ideal quarter and recommend the perfect inquiries to ask. They write for layout strategy, reliability, procedure, and box engineers; caliber coverage managers and scholars; revenues representatives; technicians; creation employees; and protection representatives.

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2 Detailed diagram for tracing contaminants during substrate fabrication Contaminant Sources in Substrates 43 CHAPTER 6 MEASURING CONTAMINANTS IN SUBSTRATES According to IPC standards and specifications, the first formal cleanliness testing is at the printed circuit level. This is the first time during the manufacture of a substrate that ionic and nonionic contaminants are measured and tested. The measurement of the different contaminants is discussed in the assembly section of this document, and the procedures used at the assembly level are also used at the substrate level.

7 Etching The chemical removal of copper can be accomplished with a variety of etching solutions; the type of resist determines what solution can be used. The chemical nature of copper requires strong oxidizing agents to dissolve it effectively. The oxidants must be strong enough to oxidize the copper, yet gentle enough to avoid damage to the substrate material or the etch resist. Common copper etchants are ferric chloride, sulfuric acid, ammonium persulfate, cupric chloride, hydrogen peroxide, and alkaline etchants [7].

They have several ideal characteristics; they resist the fusing or leveling temperature very well; they are thick, almost waxy, materials that stay where they are required; and they provide an excellent protective barrier against reoxidation of the metal. Unfortunately, the majority of polyglycols have two effects that are highly undesirable for manufacturing printed circuits. The first is that the extremely long molecules have a tendency to stand on end on any surface, but more particularly on a lipophilic organic surface, such as the bare epoxy of a printed circuit or a solder resist coating.

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Contamination of Electronic Assemblies by Elissa M. Bumiller, David A. Douthit, Joan Pecht


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